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- 1.
INDEX
- 2. COMPANY
- - History
- Multi
layer
- Heatsink
- Blind/Buried
- Impedance
- Ohmega
Ply
- - Organization
- - References
- Customer
Profile
- - Future
Direction
- New
Technologies
- - Offshore
Manufacturing
- - Micom West
(Arizona)
- - Total Quality
- 3.
PRODUCTS
- - Capabilities
- - Materials
- - How to Order
- 4.
DESIGN
- - Design
Requirements
- - Panelization
Routine
- - Impedance
Calculator
- 5. QUOTES
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 Buried Vias
- Advantages
- Fewer Process Steps than blind vias
- Increased density
- Disadvantages
- More expensive than conventional board
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- Blind Vias
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- Advantages
- Increased Density
- Disadvantages
- More Process steps
- More Expensive
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