-
- 1.
INDEX
- 2. COMPANY
- - History
- Multi
layer
- Heatsink
- Blind/Buried
- Impedance
- Ohmega
Ply
- - Organization
- - References
- Customer
Profile
- - Future
Direction
- New
Technologies
- - Offshore
Manufacturing
- - Micom West
(Arizona)
- - Total Quality
- 3. PRODUCTS
- - Capabilities
- - Materials
- - How to Order
- 4.
DESIGN
- - Design
Requirements
- - Panelization
Routine
- - Impedance
Calculator
- 5. QUOTES
|
 PROCESS CAPABILITIES
- CAD data acceptable via FTP, email, floppy
disk, or CD-ROM.
- Artwork generation via Orbotech Expert 1700 with
LP 5008A Laser plotter.
- Design verification via Expert board analyzer.
- Post etch punching of CAD generated artwork and
layers.
- Automatic Optical Inspection (AOI) of inner
layers on Orbot scanners.
- Vacuum assisted lamination.
- Drilling with complete electronic programming
functions.
- Permanganate etchback systems.
- Automatic Electroless copper plating line.
- Hot oil tin-lead fusing.
- Aqueous photoimageable and dry film soldermask.
- Net list testing.
- Controlled Impedance testing.
- Heatsink bonding.
- Complete chemical analysis capability with atomic
absorption and CVS units.
- Complete microsection and analysis laboratory on site.
- BOARD CRITERIA
|
Panel Size
|
18" x 24" max.
|
|
Overall Thickness
|
0.250" max
|
|
No. of Layers
|
38 max.
|
|
Line Width spacing
|
0.004" (inner layers)
0.005" (outer layers)
|
|
Drilled hole size
|
0.008" min.
|
|
Inner Layer core thickness
|
0.004"min.
|
|
Aspect Ratio
|
11:1
|
|
Surface Mount pad pitch
|
0.016"
|
|
Heatsinks
|
Copper , aluminum.
|
|
Buried / Blind Vias
Controlled
Impedance
|
+ / - 7.5 %
|
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