1. INDEX

2. COMPANY

- History

Multi layer

Heatsink

Blind/Buried

Impedance

Ohmega Ply

- Organization

- References

Customer Profile

- Future Direction

New Technologies

- Offshore Manufacturing

- Micom West (Arizona)

- Total Quality

 3. PRODUCTS

- Capabilities

- Materials

- How to Order

 4. DESIGN

- Design Requirements

- Panelization Routine

- Impedance Calculator

  5. QUOTES

 

                        Our future direction:

                         •  350 panels per day capacity thru put

                         •  92% average panel yield

                         •  65% military share (dollars)

                         •  35% commercial share (dollars)

                         •  18” x 24” maximum panel size

                         •  75% panels using polymide / Rogers   

                                  4350,  Getek, & High Tg FR4

                         •  25% panels with heatsinks

                         •  90% panels with soldermask           

                               • 10% dry film                              

                               • 90% liquid photo imageable

                         • Development of New Technologies