1. INDEX

2. COMPANY

- History

Multi layer

Heatsink

Blind/Buried

Impedance

Ohmega Ply

- Organization

- References

Customer Profile

- Future Direction

New Technologies

- Offshore Manufacturing

- Micom West (Arizona)

- Total Quality

 3. PRODUCTS

- Capabilities

- Materials

- How to Order

 4. DESIGN

- Design Requirements

- Panelization Routine

- Impedance Calculator

  5. QUOTES

 

A Brief History of Micom Circuits 

1965	Founded in St. Paul, Minnesota as a manufacturer of single-sided and double-sided printed circuit boards.
1974	Relocated to its present location in New Brighton, Minnesota.
1982	Multi layer capability added.
1983	Mil-P-55110 capability added.
1984	Heatsink bonding capability added.
1985	Statistical Process Control (SPC) system implemented.
1986	Polymide capability added.
1987	Expanded facility to 65,000 square feet.
1989	Blind/Buried via capability added.
1990	B.T. capability added.
1991	Controlled Impedance capability added.
1992	LPI Soldermask, Aspect Ratio 9:1.
1993	.010 drilled holes, 3Mil line, 4 Mil space.
1994	Getek capability,  Buried resistors
1995	Organic Protective Coating, Net List testing.
1996	Back Panels up to 0.250" thick.
1997	Hi-POT Testing added.
1998	Plasma Etchback added.
1999	RF Materials Added
2000	VIA Fill added.
2002	MIL-PRF 31032 added.
2003	Continuous 30 Layer Production Runs.
2004	Double Blind/Buried VIA.