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- 1.
INDEX
- 2. COMPANY
- - History
- Multi
layer
- Heatsink
- Blind/Buried
- Impedance
- Ohmega
Ply
- - Organization
- - References
- Customer
Profile
- - Future
Direction
- New
Technologies
- - Offshore
Manufacturing
- - Micom West
(Arizona)
- - Total Quality
- 3. PRODUCTS
- - Capabilities
- - Materials
- - How to Order
- 4.
DESIGN
- - Design
Requirements
- - Panelization
Routine
- - Impedance
Calculator
- 5. QUOTES
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According
to Micom’s capacity and technology, our preferred account
will meet the following requirements:
Minimum of $250,000 potential annual board requirements
Multi-Layer
product through 38 layers.
Standard 18” x 24” Panel Size
FR-4, GFG, B.T., Getek, Rogers or Polymide
laminate requirements
Surface mount, HDI, ball grid array, or through
hole requirements.
Back Panels up to 0.230" thick.
Maximum aspect ratio of 10:1.
4-5 minimum line width and spacing.
Minimum 3 day quick turn requirements ( 12
panels maximum ).
Production requirements of 6-72 panels (
18" x 24" ) per delivery
Liquid Photo Imageable solder mask, dry film
mask.
Copper coating
- Reflowed tin lead
- Hot air solder leveled
- Organic Protective coating
- Electroless Nickel/ Gold
Electrical testing
- Net list compare.
- Double Sided clam shell
test.
Controlled Impedance
Blind/Buried vias
Heat Sink bonding.
Buried Resistors
MIL-P-55110 and/or IPC 6012, IPC 276 specifications.
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