1. INDEX 2. COMPANY - History Multi layer Heatsink Blind/Buried Impedance Ohmega Ply - Organization - References Customer Profile - Future Direction New Technologies - Offshore Manufacturing - Micom West (Arizona) - Total Quality  3. PRODUCTS - Capabilities - Materials - How to Order  4. DESIGN - Design Requirements - Panelization Routine - Impedance Calculator   5. QUOTES

CHARACTERISTIC                     PROCESS CAPABILITY Layer Count 2-38 layers Board Thickness Tolerance 0.031-0.230 +/- 10% Profile Dimensions Inside Radius +/- 0.010 0.031 Finish SMOBC-HAL                                      FUSED TINLEAD SMOBC-ENTEK                           Electrolless  Nickel/Gold Line Width Tolerance 0.004 Min. +/- 0.001 Spacing 0.004 Annular Ring Dependent upon Hole to Pad ratio Prefer 0.018 Pad Size over drilled hole size 0.002 Min Pad   Plated thru hole size Tolerance (Prefer no Minimum on Via Holes) 0.008 +/- 0.003   Aspect Ratio 11:1 Plated Holes Thru board Blind Vias Buried Vias Hole Location Accuracy 0.010 dia. true pos. +/- 0.003 Base Materials FR4 140-170 Tg B.T. 210 Tg Polymide GETEK 180 Tg    Rogers  4350 SMT Pad Pitch 0.012 Solder masks L.P.I. Enthone DSR 3241 DRYFILM: DUPONT/DYNACHEM HYSOL 1010 Image Registration 0.010 Dia. True Position Wrap & Twist 0.005 In/In   Dielectric Thickness 0.003 Impedance +/- 7.5 % Board Size 16x 22 Max Heat Sink/Stiffener Bonding Glass Copper Aluminum

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