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Increased layer count capability
|
> 38 layers
|
|
Improved aspect ratio
|
> 10:1
|
|
Reduced line width and spacing
|
< 0.004/0.004"
|
|
Increased overall PCB thickness
|
> 0.230"
|
|
Reduced pad pitch
|
< 0.012"
|
|
Increase overall panel size
|
> 18" x 24"
|
|
Reduced minimum QTA lead time
|
< 3 days
|
|
Reduced controlled impedance tolerance
|
< + / - 7.5 %
|
|
Increase concurrent engineering staff
|
> 4 members
|
Back to Future Direction